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A parametric study of solute redistribution during transient liquid phase bonding process
Tien-Chien Jen
,
Thomas Hwang
and
Yuning Jiao
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15/10/2015
Handle:
https://hdl.handle.net/10210/14859
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Abstract
Transient liquid phase
Diffusion bonding
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Title
A parametric study of solute redistribution during transient liquid phase bonding process
Creators - without role
Tien-Chien Jen
Thomas Hwang
Yuning Jiao
Identifiers
9913670207691
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©2011, authors
Academic Unit
University of Johannesburg; Department of Mechanical Engineering Science
Resource Type
Journal article
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